Dear Friends and Colleagues,

SPI 2026 Paper Submission is OPEN! The Full Paper Submission Deadline is January 16, 2026.

Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following TOPICS of interest:

Modeling and simulation for SI/PI
Coupled signal and power integrity analysis
Noise reduction and equalization techniques
High-speed link design and modeling
Power distribution networks
RF/microwave/mm-wave systems and packaging solutions
Antennas-in-package and antennas-on-chip
3D IC and packages (TSV/SiP/SoC)
Nano-interconnects and nano-structures
Electromagnetic theory and modeling

Transmission line theory and modeling
Macromodeling, reduced order models
Electromagnetic compatibility
Design methodology/flow measurements
Jitter and noise modeling
Stochastic/sensitivity analysis
Electro-thermal modeling
Chip-package co-design
Novel CAD concepts
Optical interconnects
AI in electronics design

➤ Accepted papers with a Regular or a Student registration paid in full will be included in the workshop’s program and submitted for inclusion into IEEE Xplore^® (subject to meeting scope and quality requirements for IEEE Xplore^®).

➤ Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of IEEE Transactions on Components, Packaging and Manufacturing Technology.

Submit a Paper

GLOBAL SIPI UNIVERSITY @ SPI 2026

In close collaboration with the IEEE EMC and EP Societies, we are delighted to announce the introduction of the prestigious Global Signal Integrity and Power Integrity (SIPI) University at the 30th IEEE Workshop on Signal and Power Integrity!

This one-day intensive course is carefully planned to offer students, technicians, and engineers a balanced curriculum on fundamental theory and practical application, covering core concepts, analytical methods, simulation tools, and measurement techniques for solution validation. Seize this opportunity to learn from renowned experts from both industry and academia, and enhance your knowledge in SI & PI!

Check Course Details

SPI 2026 AWARDS & GRANTS

Continuing the SPI workshop tradition to acknowledge remarkable research and scholarly contributions, as well as encourage the next generation of leaders within the SPI community, we are proud to promote the Awards and Grants that will recognize outstanding papers submitted to SPI 2026!

SPI 2026 BEST PAPER AWARD • SPI 2026 BEST STUDENT PAPER AWARD • IEEE EPS STUDENT TRAVEL GRANTS

How to Apply

IMPORTANT DATES

Papers

Full Paper Submission: January 16, 2026
Notification of Acceptance: February 11, 2026
Final Paper Submission: March 27, 2026

Applications & Registrations

Student Award & Grants Application: March 27, 2026
Early Bird Registration: March 27, 2026
Sponsors Registration: March 31, 2026

Visit our website for further information about SPI 2026, and feel free to broadcast the workshop within your institution or company, as well as to your fellow colleagues and students. It is a pleasure to invite you all to send a contribution and attend the 30th IEEE Workshop on Signal and Power Integrity, taking place as in-person event from June 14 to 17, 2026, in Turin, Italy!

On behalf of the Committees,

Paolo Manfredi, Workshop Chair

Tom Dhaene & Riccardo Trinchero, Program Co-Chairs

SPI 2026 – 30th IEEE Workshop on Signal and Power Integrity

June 14-17, 2026 – Turin, Italy

Politecnico di Torino
Corso Duca degli Abruzzi, 24
10129, Turin
Italy

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